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EA-L20 Laser BGA Rework System

EA-L20 Laser BGA Rework System

精密焊接

激光扫描加热,加热路径可编辑

无热扩散,不影响周边器件

简介

激光BGA返修系统引用激光加热方式;其原理是激光经过扩束、反射、聚焦后作用于芯片表面,表面热量集聚通过热传导向内部扩散;通过数字化精确控制激光脉冲的宽度、能量、峰值功率和重复频率等参数,使锡球和焊点达到熔点后熔化,从而实现对被加工件的激光焊接。适用于密集组装产品元件的贴装和返修等。


Features

1. Fine solder, bright and beautiful solder joints.

2. High soldering speed, small thermal deformation, only heating the surface of the reworked component, small impact on the periphery, preferred choice for the dense soldering.

3. Uniform temperature and precise control of the reflow curve.

4. No nozzles required to be replaced, heating graphs programmable.

5. 21.5-inch touch screen, heating graphics drawn by the high-precision touch pen.


△t 温差控制

采用激光指定加热区域,可有效控制BOTTOM面焊点温度。可应对各种填充胶水工艺,有效控制温差。


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△t 温差控制

可编辑精确的指定加热区域,选择性加热;对周边器件无热损伤。


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Specification
电源220V AC 50Hz
总功率3500W(Max)
激光类型光纤激光
激光功率80W
光斑尺寸φ1~3mm
加热可编程范围60mm*60mm
加热扫描速度100-7000mm/s
底部预热面积300mm*300mm
底部预热功率3200W
最大PCB尺寸320mm*350mm
PCB预热温度范围室温~200℃
对位精度±0.02mm
重量约300kg
外形尺寸(L*W*H)1280*1020*1700mm
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