· Nano-silver sintered body has excellent electrical conductivity, thermal conductivity, high bonding strength and high stability, and the modules sintered by this process can be used at high temperature for a long time;

· The reliable mechanical connection and electrical connection in the die sintering layer are formed through Nano silver sintering process, which reduces the thermal resistance and internal resistance of the semiconductor module, and improves the performance and reliability of the module as a whole;

· The sintered material is pure silver, which is lead free, and is an environment-friendly material.