Solution to power device packaging

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Thermo-Compression Bonder

High accuracy: XY ±1μm@3σ, θ ±0.004°@3σ Active bond head tilt control: coplanarity 1um Fluxless solutions: H2 plasma, no chemical residue
Application field

AI

High performance computing

High Speed Die Bonder

Thermo-Compression Bonder
Cycle time:0.14s/Die XY placement:X,Y:±20μm(3σ);θ:±3°(3σ) Bonding area:X:8mm(±4mm),Y:90mm
Application field

Discrete device

Integrated circuit

MEMS, Transducer

Thermo-compression Die Bonder

High Speed Die Bonder
Compatible with Ag paste & Ag film thermo-compression process UPH: 1K Die bonding accuracy: ±10μm@3σ, θ: ±0.2° @3σ Die bonding pressure:30g-30kg (take the larger value of ±5g or ±5%) Nozzle heating: RT-250℃ Anti-oxidation design Automatic Ag film loading
Application field

Power semiconductor

New energy vehicle

Multifunctional Die Bonder

Thermo-compression Die Bonder
Multiple feeding methods: Wafer, Tray, Tape Max 6 nozzles, accuracy :± 25um, Max UPH>6K Supports large jig/carrier up to 330x660mm Automated solder preform cutting & placement Automatic nozzle & ejector pin change, supports multi-wafer and multi-chip mounting
Application field

Power semiconductor

New energy vehicle

Silver Sintering

On-line silver sintering equipment
On-line silver sintering equipment
Off-line silver sintering equipment
Off-line silver sintering equipment
Capable of small batch and mass production for multiple models Supports universal/specific toolings, with quick tool replacement Sintering area: Max. 350*270mm Sintering pressure: Max. 30MPa Sintering temperature: Max. 350°C Supported processes: Die, DTS, Clip, Module and Wafer sintering Full-process anti-oxidation protection, compatible with copper sintering
Application field

Power semiconductor

New energy vehicle

Vacuum Oven

Vacuum soldering system
Vacuum soldering system
High temperature solder paste process is supported Soldering process temperature Max 450℃ The lifting transmission is stable and vibration-free The void control can be as low as 1% Temperature uniformity ±3.5℃ Split flux management system
Application field

Power semiconductor

Automotive

Aerospace

Formic Acid Oven

Vacuum Oven
Four-chamber design for higher productivity Supports high-temperature solder preform process Max temperature 450°C, temperature uniformity ±5°C High-efficiency formic acid injection and management system with low formic acid consumption Void ratio of soldering joint can be as low as 1%
Application field

Power Semiconductor

Automotive

Industrial

Die Packaging AOI

Formic Acid Oven
Dual-Resolution Optical System Multi-Angle Shadowless Light Source Ultra DoF Fusion Technology AI Programming
Application field

Photoelectric Component

Power Module

T/R Module

Die Packaging

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