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EA-F16F Auto Solder Removal System

EA-F16F Auto Solder Removal System

非接触式风刀除锡

立体回流加热,安全可靠

适用于BGA和POP芯片除锡

Features

1. Hot air knife design for the side bearing.

2. Multiple specifications of solder removal air knife optional.

3. Fully simulating the SMT reflow soldering heating temperature at the top and bottom and programmable in adjustment.

4. Precise motion of multi-axis robot motion platform and the moving position programmable.

5. QUICK cycle heating temperature control system, real-time monitoring of heating temperature, safe and efficient.

6. Applicable to: BGA solder removal, P OP concave surface solder removal, etc.


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