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3000 BGA Re-balling Reflow Machine

3000 BGA Re-balling Reflow Machine

上下红外加热,闭环温度控制

10段温度加热

Features

1. Based on the principle of dark infrared heating, the equipment has closed-loop temperature control, precise and stable temperature and small fluctuation. With dark infrared ceramic plate heating at the bottom and high-infrared heating tube at the top, it has an extremely long service life. It minimizes the lateral temperature difference of B G A to prevent cold soldering or overheating damage of BGA.

2. Designed with an observation window, allowing real-time observation for the melting of the BGA chip solder ball, and the BGA in different specifications soldered simultaneously.

3. A sound and light alarm is provided when the heating cabinet is opened during soldering.

4. When the cabinet is opened after the process ends, the cooling fan works automatically; when the cabinet is closed, the cooling fan also stops working.

5. The panel is equipped with an external K-type sensor to monitor the actual temperature of BGA.


Specifications

Model

QUICK 3000

Top Heating Power

500W

Bottom heating power

400W

Temperature Range

50℃ - 300℃

Process Parameters

10

Heating Zone Size

130 * 130mm

Overall Dimensions

355* 225* 180mm


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