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BMS hot pressure soldering automated production line

BMS hot pressure soldering automated production line

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Automated production line for millimeter wave radar

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PTC automated production line

ECU automated production line

ECU automated production line

Solutions to semiconductor packaging

Thermo-Compression Bonder High Speed Die Bonder Thermo-compression Die Bonder Multifunctional Die Bonder Silver Sintering Vacuum Oven Formic Acid Oven Die Packaging AOI Power device packaging

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Soldering assembly/visual process

Soldering tools and equipment Selective soldering Laser soldering FPC hotbar soldering Soldering locking assembly Precision dispensing Laser marking

3D AOI & 3D SPI Die Packaging AOI

Intelligent terminal and Intelligent wear

Module Intelligent terminal Metaverse

BMS hot pressure soldering automated production line Automated production line for millimeter wave radar PTC automated production line ECU automated production line

Solutions to semiconductor packaging Thermo-Compression Bonder High Speed Die Bonder Thermo-compression Die Bonder Multifunctional Die Bonder Silver Sintering Vacuum Oven Formic Acid Oven Die Packaging AOI Power device packaging total solution

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Soldering assembly/visual process

Soldering tools and equipment Selective soldering Laser soldering FPC hotbar soldering Soldering locking assembly Precision dispensing Laser marking

AOI

3D AOI & 3D SPI Die Packaging AOI

Intelligent terminal and Intelligent wear

Module Intelligent terminal Metaverse

New energy

BMS hot pressure soldering automated production line Automated production line for millimeter wave radar PTC automated production line ECU automated production line

Semiconductor

Thermo-Compression Bonder High Speed Die Bonder Thermo-compression Die Bonder Multifunctional Die Bonder Silver Sintering Vacuum Oven Formic Acid Oven Die Packaging AOI Power device packaging

Electro-optic display

Mini-LED Mini-LED Solution to Mini-LED High speed die bonder Precision dispensing

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