Built-in flap-Laser marking-Soldering assembly/visual process-Product center-QUICK INTELLIGENT EQUIPMENT CO.,LTD.

Soldering tools and equipment

Selective soldering

Selective soldering

Laser soldering

Laser soldering

FPC hotbar soldering

FPC hotbar soldering

Soldering locking assembly

Soldering locking assembly

Precision dispensing

Precision dispensing

Laser marking

3D AOI & 3D SPI

3D AOI & 3D SPI

3D AOI & 3D SPI

Die Packaging AOI

Module

VCM CCM SIP module MIC module Antenna module Vibrating motor Charging interface PPOG module

Intelligent terminal

Smart phone Intelligent wear

Metaverse

AR/VR眼镜

BMS hot pressure soldering automated production line

BMS hot pressure soldering automated production line

Automated production line for millimeter wave radar

Automated production line for millimeter wave radar

PTC automated production line

PTC automated production line

ECU automated production line

ECU automated production line

Solutions to semiconductor packaging

Thermo-Compression Bonder High Speed Die Bonder Thermo-compression Die Bonder Multifunctional Die Bonder Silver Sintering Vacuum Oven Formic Acid Oven Die Packaging AOI Power device packaging

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Soldering assembly/visual process

Soldering tools and equipment Selective soldering Laser soldering FPC hotbar soldering Soldering locking assembly Precision dispensing Laser marking

3D AOI & 3D SPI Die Packaging AOI

Intelligent terminal and Intelligent wear

Module Intelligent terminal Metaverse

BMS hot pressure soldering automated production line Automated production line for millimeter wave radar PTC automated production line ECU automated production line

Solutions to semiconductor packaging Thermo-Compression Bonder High Speed Die Bonder Thermo-compression Die Bonder Multifunctional Die Bonder Silver Sintering Vacuum Oven Formic Acid Oven Die Packaging AOI Power device packaging total solution

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首页 > Product center > Soldering assembly/visual process > Laser marking

Built-in flap

Built-in flap

Double sided code printing, front and back flip

Reduce transmission time and improve efficiency by 30%

PAY ATTENTION TO US

Soldering assembly/visual process

Soldering tools and equipment Selective soldering Laser soldering FPC hotbar soldering Soldering locking assembly Precision dispensing Laser marking

AOI

3D AOI & 3D SPI Die Packaging AOI

Intelligent terminal and Intelligent wear

Module Intelligent terminal Metaverse

New energy

BMS hot pressure soldering automated production line Automated production line for millimeter wave radar PTC automated production line ECU automated production line

Semiconductor

Thermo-Compression Bonder High Speed Die Bonder Thermo-compression Die Bonder Multifunctional Die Bonder Silver Sintering Vacuum Oven Formic Acid Oven Die Packaging AOI Power device packaging

Electro-optic display

Mini-LED Mini-LED Solution to Mini-LED High speed die bonder Precision dispensing

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Changzhou, China

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