QUICK , established in 1993 , aims to be your global partner and your preferred destination for precision electronics assembly and backend semiconductor packaging solutions. In order to create value for our clients , we focus on our customers’ specific demands and application requirements，where reliability, high quality products, technical expertise, and application knowledge are important . Our reputation for excellence has been established through many years of successful business cases and equipment deployments. Products of noteworthy innovation include: multifunctional die bonder, eutectic die bonder , Ag sintering , formic acid soldering , laser soldering, selective soldering, laser marking, 3D AOI and integrated automation solutions.