Selective Soldering Equipment

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Selective Soldering Equipment

未标题-2.png Features

  • Modular design, strong extensibility of equipment.

  • Energy-efficient, high-quality.

  • Max PCBA dimension 610x610mm

  • Independent software, easy operation, easy understand.

  • Multiple programming methods including GERBER, JPG, file and CAD etc.

  • Unique visual graphical programming, more convenient.


未标题-2.pngModule


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                     Flux Jetting Module


●Single jetting, or dual jetting(optional).

●Imported high precision jetting valve, nozzle diameter 0.178 mm.

●Flux jetting X/Y position precision ≤±0.05mm.

●Atomized spraying and drip jetting both available for flux jetting. 

●Flux level monitoring. 



                               Preheating Module


●Top hot air and bottom infrared preheating.  

●For top and bottom preheating, the heating tubes at different area can be opened according to the size of PCBA, different area preheating and temperature controlling.   

●Preheating temperature range: 0-200℃, control accuracy: ±2℃.

●Top hot air preheating optional for soldering module, ensure the temperature in soldering process, improve soldering quality.



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                           Soldering Module


Max wave peak height: 5 mm

Max soldering temperature: 350 °C

Auto detection of solder level, alarm when solder level drops to setting value.

Nozzle connected to base via the magnetic system. Nozzle can be fast replaced. 

With lighting and camera system, the soldering process can be visual monitored.  

Adjustable distance of dual pots 79-169mm(for optional).



未标题-2.png Specifications

Equipment

Model

E L 9 W 5 0 5 0 Z D 1 A

E L 9 W 6 0 6 0 Z D 1 A

Max PCBA

510 * 510 mm

610 * 610 mm

Min PCBA

100 * 60 mm

100 * 60 mm

Top Gap of PCBA

70 mm

70 mm

Bottom Gap of PCBA

60 mm

60 mm

Side Gap of PCBA

5 mm

5 mm

Height from Conveyor Belt to Ground 

900 ± 50 mm

900 ± 50 mm

Conveyor Width Adjustable Range

60- 510 mm

60- 610 mm

Overall Dimensions (L*W* H)

2700 * 1800 * 1700 mm

3000 * 1800 * 1700 mm

Flux Jetting Module

Jetting Height

60 mm

60 mm

Positioning Speed

≤ 400 mm/s

≤ 400 mm/s

Positioning Accuracy

± 0.05 mm

± 0.05 mm

Flux Volume

2 L

2 L

Preheating Module

Temperature Range

0 -200℃

0 -200℃

Temperature Accuracy

± 2 ℃

± 2 ℃

Bottom Preheating

12 KW (Infrared)

15 KW (Infrared)

Top Preheating

8 KW (Hot Air)

8 KW (Hot Air)

Soldering Module

Max Wave Peak Height

5 mm

5 mm

Solder Pot Volume(Single)

13 kg

13 kg

Max Soldering Temperature

350 ℃

350 ℃

Required Nitrogen Purity

99.999%

99.999%

Nitrogen Consumption (Single Solder Pot)

25 L/ min

25 L/ min

Positioning Accuracy

± 0.05 mm

± 0.05 mm

未标题-2.png AOI Module(optional)

The camera will autonomously scan the PCB, capture images and compare the soldering points with qualified parameters in the database.

Through image processing, the defects on the PCB will be inspected, displayed or marked through the display for repair by the maintenance personnel.


选焊+AOI 正视图.pngInspection before soldering

AOI+选焊 正视图.pngRepair after soldering


未标题-2.png Applications

Automobile Electronics,Precise 3C, Medical Electronics and other High Requirement Applications

Inquiry

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